Method of forming metal gate electrode

ABSTRACT

An aspect of this description relates to a method that includes partially filling an opening in a dielectric material with a high-dielectric-constant material. The method also includes partially filling the opening with a first metal material over the high-dielectric-constant material. The method further includes filling the opening with a capping layer over the first metal material. The method additionally includes partially removing the first metal material and the capping layer in the opening using a wet etching process in a solution including one or more of H 2 O 2 , NH 4 OH, HCl, H 2 SO 4  or diluted HF. The method also includes fully removing the remaining capping layer in the opening using a wet etching process in a solution includes one or more of NH 4 OH or diluted HF. The method further includes depositing a second metal material in the opening over the remaining first metal material.

PRIORITY CLAIM

The present invention is a continuation of U.S. application Ser. No.14/018,087, filed Sep. 4, 2013, which is a divisional of U.S.application Ser. No. 13/189,732, filed Jul. 25, 2011, now U.S. Pat. No.8,546,885, issued Oct. 1, 2013, the disclosures of which areincorporated herein by reference in their entireties.

FIELD OF THE INVENTION

The invention relates to integrated circuit fabrication and, moreparticularly, to a method of making a Field Effect Transistor with ametal gate electrode.

BACKGROUND

Semiconductor devices are used in a large number of electronic devices,such as computers, cell phones, and others. Semiconductor devicescomprise integrated circuits (ICs) that are formed on semiconductorwafers by depositing many types of thin films of material over thesemiconductor wafers, and patterning the thin films of material to formthe ICs. The ICs include field-effect transistors (FETs), such asmetal-oxide-semiconductor field effect transistors (MOSFETs).

As technology nodes shrink, in some IC designs, there has been a desireto replace the typically polysilicon gate electrode with a metal gateelectrode to improve device performance with the decreased featuresizes. One process of forming the metal gate electrode is termed a “gatelast” process in which the final metal gate electrode is fabricatedafter all of the other transistor components, which allows for a reducednumber of subsequent processes, including high temperature processing,that must be performed after formation of the gate.

However, there are challenges to implementing such features andprocesses in complementary metal-oxide-semiconductor (CMOS) fabrication.As the gate length and spacing between devices decrease, these problemsare exacerbated. For example, in a “gate last” fabrication process, itis difficult to achieve a low gate resistance for a FET because voidsare generated in the metal gate electrode after metal layer depositionfor gap filling of a high-aspect-ratio trench, thereby increasing thelikelihood of device instability and/or device failure.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale and are used for illustration purposesonly. In fact, the dimensions of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIG. 1 is a flowchart illustrating a method of fabricating a metal gateelectrode of a Field Effect Transistor according to various aspects ofthe present disclosure; and

FIGS. 2A-H show schematic cross-sectional views of a Field EffectTransistor comprising a metal gate electrode at various stages offabrication according to various aspects of the present disclosure.

DETAILED DESCRIPTION

It is understood that the following disclosure provides many differentembodiments, or examples, for implementing different features of theinvention. Specific examples of components and arrangements aredescribed below to simplify the present disclosure. These are, ofcourse, merely examples and are not intended to be limiting. Forexample, the formation of a first feature over or on a second feature inthe description that follows may include embodiments in which the firstand second features are formed in direct contact, and may also includeembodiments in which additional features may be formed between the firstand second features, such that the first and second features may not bein direct contact. Various features may be arbitrarily drawn indifferent scales for simplicity and clarity. In addition, the presentdisclosure provides examples of a “gate last” metal gate process,however, one skilled in the art may recognize applicability to otherprocesses and/or use of other materials.

Referring to FIG. 1, illustrated is a flowchart of a method 100 offabricating a metal gate electrode of a field effect transistoraccording to various aspects of the present disclosure. The method 100begins with step 102 in which a substrate comprising an isolation regionsurrounding an active region is provided. The method 100 continues withstep 104 in which a dielectric layer is formed over the active region.The method 100 continues with step 106 in which an opening is formed inthe dielectric layer. The method 100 continues with step 108 in whichthe opening is partially filled with a high-dielectric-constant (high-k)material. The method 100 continues with step 110 in which the opening ispartially filled with a conformal first metal material over thehigh-dielectric-constant material. The method 100 continues with step112 in which the opening is filled with a capping layer over the firstmetal material. The method 100 continues with step 114 in which thecapping layer is planarized to the high-dielectric-constant material.The method 100 continues with step 116 in which the first metal materialand capping layer in the opening are partially removed using a wetetching process in a solution comprising H₂O₂, NH₄OH, HCl, H₂SO₄, anddiluted HF. The method 100 continues with step 118 in which theremaining capping layer in the opening is fully removed using a wetetching process in a solution comprising NH₄OH and diluted HF. Themethod 100 continues with step 120 in which a second metal material isdeposited in the opening over the remaining first metal material. Themethod 100 continues with step 122 in which the second metal material isplanarized. The discussion that follows illustrates an embodiment of ametal gate electrode of a field effect transistor that can be fabricatedaccording to the method 100 of FIG. 1.

FIGS. 2A-H show schematic cross-sectional views of a field effecttransistor (FET) 200 comprising a metal gate electrode 220 at variousstages of fabrication according to various aspects of the presentdisclosure. It is noted that the method of FIG. 1 does not produce acompleted FET 200. A completed FET 200 may be fabricated usingcomplementary metal-oxide-semiconductor (CMOS) technology processing.Accordingly, it is understood that additional processes may be providedbefore, during, and after the method 100 of FIG. 1, and that some otherprocesses may only be briefly described herein. Also, FIGS. 1 through 2Hare simplified for a better understanding of the inventive concepts ofthe present disclosure. For example, although the figures illustrate ametal gate electrode 220 for the FET 200, it is understood theintegrated circuit (IC) may comprise a number of other devicescomprising resistors, capacitors, inductors, fuses, etc.

Referring to FIG. 2A, a substrate 202 is provided. The substrate 202 maycomprise a silicon substrate. The substrate 202 may alternativelycomprise silicon germanium, gallium arsenic, or other suitablesemiconductor materials. The substrate 202 may further comprise otherfeatures such as various doped regions, a buried layer, and/or anepitaxial (epi) layer. Furthermore, the substrate 202 may be asemiconductor on insulator such as silicon on insulator (SOI). In otherembodiments, the semiconductor substrate 202 may comprise a doped epilayer, a gradient semiconductor layer, and/or may further include asemiconductor layer overlying another semiconductor layer of a differenttype such as a silicon layer on a silicon germanium layer. In otherexamples, a compound semiconductor substrate may comprise a multilayersilicon structure or a silicon substrate may include a multilayercompound semiconductor structure.

In the present embodiments, the substrate 202 may comprise an isolationregion 204 surrounding an active region 206. The active region 206 mayinclude various doping configurations depending on design requirements.In some embodiments, the active region 206 may be doped with p-type orn-type dopants. For example, the active region 206 may be doped withp-type dopants, such as boron or BF₂; n-type dopants, such as phosphorusor arsenic; and/or combinations thereof. The active region 206 may beconfigured for an N-type metal-oxide-semiconductor field effecttransistor (referred to as an NMOS) or for a P-typemetal-oxide-semiconductor field effect transistor (referred to as aPMOS).

The isolation regions 204 may utilize isolation technology, such aslocal oxidation of silicon (LOCOS) or shallow trench isolation (STI), todefine and electrically isolate the various active regions 206. In thepresent embodiment, the isolation region 204 comprises a STI. Theisolation regions 204 may comprise materials such as silicon oxide,silicon nitride, silicon oxynitride, fluoride-doped silicate glass(FSG), a low-dielectric-constant (low-k) material, and/or combinationsthereof. The isolation regions 204, and in the present embodiment, theSTI, may be formed by any suitable process. As one example, theformation of the STI may include patterning the semiconductor substrate202 by a photolithography process, etching a trench in the substrate 202(for example, by using a dry etching, wet etching, and/or plasma etchingprocess), and filling the trench (for example, by using a chemical vapordeposition process) with a dielectric material. In some embodiments, thefilled trench may have a multi-layer structure such as a thermal oxideliner layer filled with silicon nitride or silicon oxide.

In a gate last process, a dummy gate structure 210 comprising a dummyoxide 212 and a dummy gate electrode 214 is formed on the substrate 202.The dummy gate structure 210 may be formed using any suitable process,including the processes described herein. In one example, the dummyoxide 212 and dummy gate electrode 214 are sequentially deposited on thesubstrate 202. In the present embodiment, the dummy oxide 212 may beformed of silicon oxide grown by a thermal oxidation process, having athickness of about 10 to 30 Angstroms (Å). For example, the dummy oxide212 can be grown by the rapid thermal oxidation (RTO) process or in anannealing process comprising oxygen.

In some embodiments, the dummy gate electrode 214 may comprise a singlelayer or multilayer structure. In the present embodiment, the dummy gateelectrode 214 may comprise polysilicon. Further, the dummy gateelectrode 214 may be doped polysilicon with the same or differentdoping. The dummy gate electrode 214 comprises any suitable thickness.In the present embodiment, the dummy gate electrode 214 comprises athickness in the range of about 30 nm to about 60 nm. The dummyelectrode 214 may be formed using a low-pressure chemical vapordeposition (LPCVD) process.

A layer of photoresist is formed over the dummy gate electrode 214 by asuitable process, such as spin-on coating, and patterned to form apatterned photoresist feature by a proper lithography patterning method.A width of the patterned photoresist feature is in the range of about 15to 32 nm. The patterned photoresist feature can then be transferredusing a dry etching process to the underlying layers (i.e., the dummyoxide 212 and the dummy gate electrode 214) to form the dummy gatestructure 210. The photoresist layer may be stripped thereafter. It isunderstood that the above examples do not limit the processing stepsthat may be utilized to form the dummy gate structure 210.

After formation of the dummy gate structure 210, a dielectric layer 216is deposited over the dummy gate structure 210 and extending over theactive region 206. The dielectric layer 216 may be formed of siliconoxide, silicon nitride or other suitable materials by a chemical vapordeposition (CVD) process. A portion of the dielectric layer 216 over atop surface of the dummy gate structure 210 is removed using a dryetching process to form a pair of gate spacers 216 on opposite sidewallsof the dummy gate structure 210. For example, the dry etching processmay be performed using CH₂F₂, O₂, and Ar as etching gases.

It is noted that the FET 200 may undergo other CMOS technologyprocessing to form various features of the FET 200. As such, the variousfeatures are only briefly discussed herein. The various components ofthe FET 200 are formed prior to formation of the metal gate electrode220 in a “gate last” process. The various components may comprisesource/drain (n-type and p-type S/D) regions (not shown) and lightlydoped source/drain (n-type and p-type LDD) regions (not shown) in theactive region 206 on opposite sides of the metal gate electrode 220. Then-type S/D and LDD regions may be doped with P or As, and the p-type S/Dand LDD regions may be doped with B or In.

Then, an interlayer dielectric (ILD) layer 218 is deposited over thedummy gate structure 210, the pair of gate spacers 216 and extendingover the substrate 202. The ILD 218 may include an oxide formed by ahigh aspect ratio process (HARP) and/or high density plasma (HDP)deposition process. A chemical mechanical polishing (CMP) is performedon the ILD 218 to expose the dummy gate structure 210.

The dummy gate structure 210 may then be removed thereby forming anopening 208 in the dielectric layer 216 (i.e., between the gate spacers216) (shown in FIG. 2B). The dummy gate electrode 214 may be removedusing a wet etch and/or a dry etch process. In one embodiment, a wetetch process includes exposure to a hydroxide solution containingammonium hydroxide, diluted HF, deionized water, and/or other suitableetchant solutions. In another embodiment, a dry etch process may beperformed under a source power of about 650 to 800 W, a bias power ofabout 100 to 120 W, and a pressure of about 60 to 200 mTorr, using Cl₂,HBr and He as etching gases. Further, the dummy oxide 212 may be removedusing a wet etch. The wet etch process includes exposure to a diluted HFsolution, and/or other suitable etchant solutions.

Referring to FIG. 2C, following formation of the opening 208 in thedielectric layer 216, the opening 208 is partially filled with ahigh-dielectric-constant (high-k) material 222. In one embodiment, thehigh-k material 222 comprises certain metal oxides. Examples of metaloxides used for the high-k material 222 include oxides of Li, Be, Mg,Ca, Sr, Sc, Y, Zr, Hf, Al, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er,Tm, Yb, Lu and mixtures thereof. In the present embodiment, the high-kmaterial 222 comprises HfO_(x) with a thickness in the range of about 10to 30 angstroms. The high-k material 222 may be formed using a suitableprocess such as atomic layer deposition (ALD), chemical vapor deposition(CVD), physical vapor deposition (PVD), thermal oxidation, UV-ozoneoxidation, or combinations thereof. The high-k material 222 may furthercomprise an interfacial layer (not shown) to reduce damage between thehigh-k material 222 and the substrate 202. The interfacial layer maycomprise silicon oxide.

The opening 208 is partially filled with a conformal first metalmaterial 224 over the high-k material 222. In the present embodiment,the conformal first metal material 224 is deposited before a secondmetal material 228 (shown in FIG. 2H) to reduce diffusion of a signalmetal 228 b to the high-k material 222. In one embodiment, the conformalfirst metal material 224 comprises a material selected from a group ofTiN, TaN, and WN. The conformal first metal material 224 has a thicknessranging from 5 to 15 angstroms. The conformal first metal material 224may be formed by CVD, PVD, or other suitable technique.

The opening 208 is filled with a capping layer 226 over the conformalfirst metal material 224. In some embodiments, the capping layer 226 maycomprise a single layer or multilayer structure. In the presentembodiment, the capping layer 226 may comprise polysilicon, amorphoussilicon, or silicon nitride. Further, the capping layer 226 may be dopedsilicon with the same or different doping. The capping layer 226comprises any suitable thickness. In the present embodiment, the cappinglayer 226 comprises a thickness in the range of about 45 nm to about 65nm. The capping layer 226 may be formed using an LPCVD process.

Then, a chemical mechanical polishing (CMP) process is performed toremove a portion of the capping layer 226 and conformal first metalmaterial 224 outside of the opening 208. Accordingly, the CMP processmay stop when reaching the high-k material 222, and thus providing asubstantially planar surface (shown in FIG. 2D).

The remaining capping layer 226 within the opening 208 may be removed,thereby forming a high-aspect-ratio trench for the FET 200. Thehigh-aspect-ratio trench may impede metal material from entering into abottom portion of the trench and generate voids in the trench, therebyincreasing the likelihood of device instability and/or device failure.

Accordingly, the processing discussed below with reference to FIGS.2E-2H may remove at least an upper portion of the conformal first metalmaterial 224 to lower the aspect ratio of the trench to make it easierfor further metal depositions into the trench. This can reduce voidgeneration in a metal gate electrode in a high-aspect-ratio trench andupgrade device performance.

FIG. 2E shows the FET 200 of FIG. 2D after the conformal first metalmaterial 224 and capping layer 226 in the opening 208 are partiallyremoved using a wet etching process in a solution comprising H₂O₂,NH₄OH, HCl, H₂SO₄, and diluted HF. The etching process forms a trench308 within the opening 208. The remaining first metal material 224within the opening 208 may have a maximum height h₁ ranging from about1.5 to about 45 nm. The height h₁ can be achieved through tuning variousparameters of the etching process such as time and etching chemistry.

Referring to FIG. 2F, following partially removing the conformal firstmetal material 224 and capping layer 226 in the opening 208, theremaining capping layer 226 in the opening 208 is fully removed using awet etching process in a solution comprising NH₄OH and diluted HF. Theprocess steps up to this point have provided a substrate having alow-aspect-ratio trench 308 to make it easier for further metaldepositions into the trench 308. This can reduce void generation in ametal gate electrode in a high-aspect-ratio trench and upgrade deviceperformance.

In the present embodiment, the remaining first metal material 224 withinthe opening 208 forms a lower portion 220 l of the metal gate electrode220 (shown in FIG. 2H). In one embodiment, the lower portion 220 l issubstantially U-shaped. In another embodiment, the lower portion 220 lhas a recess 224 r, a bottom portion 224 b and sidewall portions 224 s,wherein each of the sidewall portions 224 s has a first width W₁.

Referring to FIG. 2G, after removal of the remaining capping layer 226in the opening 208, a second metal material 228 is deposited over thefirst metal material 224 to fill the trench 308. In the presentembodiment, a work-function metal 232 is first deposited over the firstmetal material 224, and a signal metal 234 is then deposited over thework-function metal 232. The work-function metal 232 and signal metal234 are combined and referred to as the second metal material 228.Further, the thickness of the second metal material 228 will depend onthe depth of the trench 308. The second metal material 228 is thusdeposited until the trench 308 is substantially filled.

In an NMOS embodiment, the second metal material 228 may comprise anN-work-function metal. In some embodiments, the N-work-function metalcomprises a metal selected from a group of Ti, Ag, Al, TiAl, TiAlN, TaC,TaCN, TaSiN, Mn, and Zr. In some embodiments, the N-work-function metalmay be formed by CVD, PVD, plating, spin-on, ALD, or other suitabletechnique. In a PMOS embodiment, the second metal material 228 comprisesa P-work-function metal. In some embodiments, the P-work-function metalcomprises a metal selected from a group of TiN, WN, TaN, and Ru. In someembodiments, the P-work-function metal may be formed by CVD, PVD,plating, spin-on, ALD, or other suitable technique.

In a PVD embodiment, the work-function metal 232 comprises a bottomportion 232 b having a first thickness t₁ and sidewall portions 232 shaving a second thickness t₂ less than the first thickness t₁. In oneembodiment, a ratio of the second thickness t₂ to the first thickness t₁is from 0.5 to 0.9. In an ALD embodiment, the work-function metal 232comprises a bottom portion 232 b having a first thickness t₁ andsidewall portions 232 s having a second thickness t₂ substantially equalto the first thickness t₁.

Further, the signal metal 234 may comprise a material selected from agroup of Al, Cu, Co and W. The signal metal 234 may be formed by CVD,PVD, plating, spin-on, ALD, or other suitable technique. In someembodiments, the signal metal 234 may comprise a laminate. The laminatemay further comprise a barrier metal layer, a linear metal layer or awetting metal layer.

Referring to FIG. 2H, another CMP is performed to planarize the secondmetal material 228 after filling the trench 308. Since the CMP removes aportion of the second metal material 228 outside of the trench 308, theCMP process may stop when reaching the high-k material 222, and thusprovide a substantially planar surface.

In the present embodiment, the first metal material 224 and the secondmetal material 228 in the opening 208 are combined and referred to asthe metal gate electrode 220. In one embodiment, the second metalmaterial 228 within the opening 208 forms an upper portion 220 u of themetal gate electrode 220. In one embodiment, the upper portion 220 u issubstantially T-shaped. In some embodiments, the upper portion 220 u hasa protrusion 220 p and a bulk portion 220 k, wherein the bulk portion220 k has a second width W₂, wherein the protrusion 220 p extends intothe recess 224 r of the lower portion 220 l, wherein a ratio of thesecond width W₂ to the first width W₁ is from about 5 to 10. In someembodiments, the upper portion 220 u has a minimum height h₂. A ratio ofthe maximum height (h₁) of the lower portion 220 l to a minimum height(h₂) of the upper portion 220 u is from 0.1 to 0.9. Accordingly,Applicant's method of fabricating a FET 200 may fabricate a void-freemetal gate electrode to reduce gate resistance and upgrade deviceperformance.

In one embodiment, a metal gate electrode for a field effect transistorcomprises a lower portion formed of a first metal material, wherein thelower portion has a recess, a bottom portion and sidewall portions,wherein each of the sidewall portions has a first width; and an upperportion formed of a second metal material, wherein the upper portion hasa protrusion and a bulk portion, wherein the bulk portion has a secondwidth, wherein the protrusion extends into the recess, wherein a ratioof the second width to the first width is from about 5 to 10.

In another embodiment, a method of fabricating a metal gate electrode ofa Field Effect Transistor comprises providing a substrate comprising anisolation region surrounding an active region; forming a dielectriclayer over the active region; forming an opening in the dielectriclayer; partially filling the opening with a high-dielectric-constantmaterial; partially filling the opening with a conformal first metalmaterial over the high-dielectric-constant material; filling the openingwith a capping layer over the first metal material; planarizing thecapping layer to the high-dielectric-constant material; partiallyremoving the first metal material and capping layer in the opening usinga wet etching process in a solution comprising H₂O₂, NH₄OH and dilutedHF; fully removing the remaining capping layer in the opening using awet etching process in a solution comprising NH₄OH and diluted HF;depositing a second metal material in the opening over the remainingfirst metal material; and planarizing the second metal material.

It is understood that the FET 200 may undergo further CMOS process flowto form various features such as contacts/vias, interconnect metallayers, dielectric layers, passivation layers, etc.

An aspect of this description relates to a method comprising partiallyfilling an opening in a dielectric material with ahigh-dielectric-constant material. The method also comprises partiallyfilling the opening with a first metal material over thehigh-dielectric-constant material. The method further comprises fillinga remaining portion of the opening with a capping layer over the firstmetal material. The method additionally comprises partially removing thefirst metal material and the capping layer in the opening using a firstwet etching process. The method also comprises fully removing theremaining capping layer in the opening using a second wet etchingprocess. The method further comprises depositing a second metal materialin the opening over the remaining first metal material.

Another aspect of this description relates to a method of fabricating ametal gate electrode of a field effect transistor. The method comprisesremoving a portion of a dielectric layer to form an opening in thedielectric layer, the dielectric layer being over a substrate. Themethod also comprises filling the opening, wherein filling the openingcomprises filling the opening with a high-dielectric-constant material,a conformal first metal material over the high-dielectric-constantmaterial, and a capping layer over the first metal material. The methodfurther comprises planarizing the capping layer to expose thehigh-dielectric-constant material. The method additionally comprisespartially removing the first metal material and capping layer in theopening using a first wet etching process. The method also comprisesfully removing the remaining capping layer in the opening using a secondwet etching process. The method additionally comprises depositing asecond metal material in the opening over the remaining first metalmaterial.

A further aspect of this description relates to a method comprisingpartially filling an opening in a dielectric layer with a first materialto form a first portion of an electrode. The first portion of theelectrode being is formed comprising a bottom portion having a firstsurface extending in a first direction, a first sidewall portion havinga second surface at a first side of the first surface, the secondsurface extending in a second direction different from the firstdirection, a second sidewall portion having a third surface at a secondside of the first surface, the third surface extending in a thirddirection different from the first direction, and a first recess definedby the first surface, the second surface and the third surface. Themethod also comprises partially filling the opening in the dielectriclayer with a second material different from the first material to form asecond portion of the electrode over the first portion of the electrode.The second portion of the electrode is formed comprising a protrusionportion within the first recess, a bulk portion, and a second recessdefined by the bulk portion and the protrusion portion. The methodfurther comprises filling the second recess with a signal metal. Thesignal metal is accommodated within the second recess such that thesecond portion of the electrode has a thickness between the firstsurface and a nearest bottom surface of the signal metal. At least oneof the second surface or the third surface extends from the firstsurface in a direction toward the signal metal. At least one of thesecond surface or the third surface has a length from the first surfaceto an end of the second surface or an end of the third surface less thanthe thickness of the second portion of the electrode.

While the invention has been described by way of example and in terms ofthe exemplary embodiments, it is to be understood that the invention isnot limited to the disclosed embodiments. To the contrary, it isintended to cover various modifications and similar arrangements (aswould be apparent to those skilled in the art). Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

What is claimed is:
 1. A method, comprising: partially filling anopening in a dielectric material with a high-dielectric-constantmaterial; partially filling the opening with a first metal material overthe high-dielectric-constant material; filling a remaining portion ofthe opening with a capping layer over the first metal material;partially removing the first metal material and the capping layer in theopening using a first wet etching process; fully removing the remainingcapping layer in the opening using a second wet etching process; anddepositing a second metal material in the opening over the remainingfirst metal material.
 2. The method of claim 1, further comprising:planarizing the capping layer to be coplanar with thehigh-dielectric-constant material.
 3. The method of claim 1, wherein thesecond metal material is deposited having a bottom portion and sidewallportions, the bottom portion is formed having a first thickness in afirst direction, the sidewall portions are formed having a secondthickness in a second direction different from the first direction, andthe second thickness is less than the first thickness.
 4. The method ofclaim 1, wherein the second metal material is deposited having a bottomportion and sidewall portions, the bottom portion is formed having afirst thickness in a first direction, the sidewall portions are formedhaving a second thickness in a second direction different from the firstdirection, and the second thickness is substantially equal to the firstthickness.
 5. The method of claim 1, wherein depositing the second metalmaterial comprises depositing a work-function metal into the opening. 6.The method of claim 1, further comprising: planarizing the second metalmaterial.
 7. The method of claim 1, wherein the first wet etchingprocess is different from the second wet etching process.
 8. The methodof claim 1, wherein the first wet etching process uses a first solutioncomprising one or more of H₂O₂, NH₄OH, HCl, H₂SO₄ or diluted HF.
 9. Themethod of claim 8, wherein the second wet etching process uses a secondsolution comprising one or more of NH₄OH or diluted HF.
 10. A method offabricating a metal gate electrode of a field effect transistor, themethod comprising: removing a portion of a dielectric layer to form anopening in the dielectric layer, the dielectric layer being over asubstrate; filling the opening, wherein filling the opening comprisesfilling the opening with a high-dielectric-constant material, aconformal first metal material over the high-dielectric-constantmaterial, and a capping layer over the first metal material; planarizingthe capping layer to expose the high-dielectric-constant material;partially removing the first metal material and capping layer in theopening using a first wet etching process; fully removing the remainingcapping layer in the opening using a second wet etching process; anddepositing a second metal material in the opening over the remainingfirst metal material.
 11. The method of claim 10, wherein the cappinglayer is formed by depositing polysilicon, amorphous silicon or siliconnitride over the first metal material.
 12. The method of claim 10,wherein the first wet etching process uses a first solution comprisingat lease one chemical compound included in a second solution used in thesecond wet etching process.
 13. The method of claim 10, wherein thefirst wet etching process uses a solution comprising H₂O₂, NH₄OH, HCl,H₂SO₄ and diluted HF.
 14. The method of claim 10, wherein the second wetetching process uses a solution comprising NH₄OH and diluted HF.
 15. Amethod, comprising: partially filling an opening in a dielectric layerwith a first material to form a first portion of an electrode, the firstportion of the electrode being formed comprising: a bottom portionhaving a first surface extending in a first direction; a first sidewallportion having a second surface at a first side of the first surface,the second surface extending in a second direction different from thefirst direction; a second sidewall portion having a third surface at asecond side of the first surface, the third surface extending in a thirddirection different from the first direction; and a first recess definedby the first surface, the second surface and the third surface;partially filling the opening in the dielectric layer with a secondmaterial different from the first material to form a second portion ofthe electrode over the first portion of the electrode, the secondportion of the electrode being formed comprising: a protrusion portionwithin the first recess; a bulk portion; and a second recess defined bythe bulk portion and the protrusion portion; and filling the secondrecess with a signal metal, wherein the signal metal is accommodatedwithin the second recess such that the second portion of the electrodehas a thickness between the first surface and a nearest bottom surfaceof the signal metal, at least one of the second surface or the thirdsurface extends from the first surface in a direction toward the signalmetal, and at least one of the second surface or the third surface has alength from the first surface to an end of the second surface or an endof the third surface less than the thickness of the second portion ofthe electrode.
 16. The method of claim 15, wherein partially filling theopening in the dielectric layer with the first material comprises:depositing a first metal into the opening in the dielectric layer. 17.The method of claim 16, wherein partially filling the opening in thedielectric layer with the second material comprises: depositing a secondmetal into the first recess.
 18. The method of claim 15, furthercomprising: removing a portion of the dielectric layer over an activeregion of a substrate to form the opening in the dielectric layer. 19.The method of claim 18, wherein the substrate is exposed by removing theportion of the dielectric layer, and the method further comprises:growing an oxide layer within the opening by performing a rapid thermaloxidation process on the substrate.
 20. The method of claim 16, furthercomprising: removing substrate material to form a trench in thesubstrate surrounding the active region of the substrate; and fillingthe trench with a dielectric material to form an isolation region in thesubstrate.